Address
Building A1, Runteng Industrial Park, No. 4 Xishan Road, Longteng Community, Shiyan Subdistrict, Bao'an District, Shenzhen 518000, China
Work Hours
Monday to Saturday: 09:00 – 23:00 (UTC+8)
Sunday: closed
Address
Building A1, Runteng Industrial Park, No. 4 Xishan Road, Longteng Community, Shiyan Subdistrict, Bao'an District, Shenzhen 518000, China
Work Hours
Monday to Saturday: 09:00 – 23:00 (UTC+8)
Sunday: closed

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LEAD-FREE HOT AIR REFLOW OVEN
Achieve ±1°C temperature control across 20 independent heating zones with German Hotset heating elements and Siemens PLC control. The R10 combines intelligent current diversion that cuts energy consumption by 30%, world-class Japanese and German components, and a 6,380mm full-length tunnel to deliver reliable reflow soldering for automotive, medical, and consumer electronics manufacturers worldwide.
JHIMS R10 Lead Free Hot Air Reflow Oven
The JHIMS R10 is a 10-zone lead-free hot air reflow oven engineered for high-volume SMT reflow soldering in PCB assembly. As a hot air reflow soldering machine rated to 300°C, it handles both lead-free (RoHS) and leaded solder alloys with ±1°C accuracy across 20 heating zones. Featuring 20 independent heating zones (10 upper + 10 lower) with PID closed-loop control and a 3,840mm preheating tunnel, the R10 delivers uniform thermal profiles board after board, while the 1,260mm dual-sided cooling section ensures controlled solidification for high-reliability solder joints.
Engineered with premium components from Hotset (Germany), Siemens (Germany), Omron (Japan), Schneider (France), and NSK (Japan), the R10 delivers industrial-grade reliability for 24/7 production environments.
Applications: Reflow soldering for automotive electronics, medical devices, consumer electronics, LED lighting, new energy, industrial automation, home appliances and telecommunications PCB assembly.
10 upper + 10 lower heating zones with independent PID closed-loop control. Each zone is individually calibrated and monitored, allowing precise thermal profiling for any PCB assembly — from simple single-sided boards to complex double-sided designs with mixed component sizes. Total preheating length: 3,840mm.
World-class heating wire technology from Hotset (Germany) delivers ±1°C temperature precision with exceptional long-term stability. These industrial-grade elements resist oxidation and thermal degradation, ensuring consistent performance over tens of thousands of production cycles.
3 upper + 3 lower cooling zones spanning 1,260mm provide controlled ramp-down for optimal intermetallic layer formation. The symmetrical cooling design prevents board warpage and ensures uniform joint solidification for brighter, mechanically stronger solder connections.
Industrial-grade Siemens PLC paired with a Windows 10 industrial PC delivers a powerful yet intuitive control interface. Full touch screen operation with real-time thermal profiling, recipe management for unlimited profiles, data logging, and remote monitoring capabilities.
Auto current diversion technology reduces current draw by 40-50% and electricity consumption by 30%. Operating power drops from 45KW startup to 11-13KW during normal running — one of the most energy-efficient reflow ovens in its class.
One-touch motorized top cover provides full furnace access for cleaning and maintenance. Eliminates the physical effort and time required for manual cover lifting, reducing weekly maintenance procedures from 45 minutes to under 10 minutes.
Integrated Zhuhai Shante UPS (Uninterruptible Power Supply) automatically engages during power outages, keeping the transport system running to safely evacuate all boards from the furnace. Protects work-in-progress PCBs worth thousands of dollars from thermal damage.
PANASONIC (Japan) motor-driven precision width adjustment enables rapid product changeover at the touch of a button. Supports PCB widths up to 460mm with automatic centering and stored width presets for frequent production recipes.
| Parameter | Specification | Parameter | Specification |
|---|---|---|---|
| Model | JHIMS R10 | Machine Dimensions | 6380 × 1445 × 1520 mm |
| Net Weight | 2,550 kg | Gross Weight | ~2,900 kg (with packaging) |
| Power Supply | 5-wire 3-phase; 380V 50/60Hz | Startup Power | 45 KW |
| Normal Operating Power | 11 – 13 KW | Energy Savings | 30% reduction via auto current diversion |
| Temperature Range | Room temp to 300°C | Temperature Accuracy | ±1°C |
| Max PCB Width | 460 mm | Component Height Clearance | Top: 25 mm / Bottom: 25 mm |
| Transport Speed | 300 – 2,000 mm/min | Transport System | Mesh belt + guide rail chain |
| Heating Zones | 10 upper + 10 lower (20 total) | Preheating Length | 3,840 mm |
| Cooling Zones | 3 upper + 3 lower (6 total) | Cooling Length | 1,260 mm |
| Control System | Windows 10 + Industrial PC + Siemens PLC | Temperature Control | PID closed-loop + SSR drive |
| Rail Width Adjustment | Electric (PANASONIC motor) | Top Cover | Electric motorized opening |
| Backup Protection | UPS (Zhuhai Shante) | Heating Element Type | Hot air convection |
| Soldering Compatibility | Lead-free (RoHS) + Leaded | Max Operating Temperature | 300°C |
| Exhaust System | Built-in fume extraction ports | Nitrogen Option | Available (factory-installed) |
| Data Logging | Full traceability | Warranty | 1 Year standard (extendable) |
Every JHIMS R10 is built with world-class components. We source only from industry-leading brands to ensure long-term reliability and precision.
The JHIMS R10 Lead Free Hot Air Reflow Oven is a versatile workhorse deployed across mission-critical electronics manufacturing sectors worldwide.
Automotive PCBs demand IPC Class 3 reliability with zero-defect soldering. The R10’s ±1°C accuracy and 20-zone control ensure consistent solder joint quality for engine control units (ECU), ADAS modules, BMS boards, and infotainment systems. The extended 3,840mm preheating zone handles large thermal mass assemblies common in automotive power electronics, while the 1,260mm controlled cooling prevents thermal shock on ceramic capacitors and BGAs. With IATF 16949-compatible traceability and full data logging, the R10 meets the rigorous quality documentation requirements of tier-1 automotive suppliers.
Medical electronics require the highest levels of process control and repeatability. The R10’s PID closed-loop SSR drive system delivers consistent thermal profiles batch after batch, critical for FDA-regulated Class II and Class III medical devices. The nitrogen atmosphere option prevents oxidation on fine-pitch components used in implantable devices, diagnostic equipment, and patient monitoring systems. Full temperature traceability with timestamp logging provides the quality documentation required for ISO 13485 compliance and regulatory audits. The UPS backup system protects high-value medical PCB assemblies during unexpected power interruptions.
Smartphones, tablets, wearables, and IoT devices demand high-throughput reflow with zero defects on ultra-fine-pitch components. The R10’s 2,000 mm/min maximum transport speed and mesh belt + guide rail system handle high-volume consumer electronics production with ease. The electric width adjustment enables rapid changeover between different product models, maximizing line utilization. Smart current diversion technology keeps operating costs low at just 11-13KW, directly improving the unit economics of high-volume consumer electronics manufacturing. Compatible with both lead-free SAC305 and low-temperature solders for flexible hybrid assemblies.
Industrial control boards, power supplies, motor drives, and IoT gateways often feature mixed-technology assemblies with large thermal mass components. The R10’s 20-zone architecture with 3,840mm preheating provides the thermal capacity needed to bring heavy copper boards, large connectors, and power MOSFETs to reflow temperature without overheating small components. The dual-sided heating and cooling system handles THT+SMT hybrid boards with up to 25mm top and bottom component clearance, while built-in fume extraction ports keep the production environment clean and compliant.
Understanding reflow soldering technology is essential for optimizing your SMT assembly process. Below is a comprehensive technical reference for engineers and process managers.
Reflow soldering melts pre-deposited solder paste to form reliable electrical and mechanical joints. The process follows a controlled thermal profile: ramp-up, soak, reflow (peak), and cooling. The R10’s 20 independent zones let you program each phase precisely — a typical SAC305 lead-free profile ramps at 1-3°C/s, soaks at 150-200°C for 60-120s, peaks at 235-250°C, and cools at 2-4°C/s. The 3,840mm preheat tunnel provides the soak time large thermal mass boards need, while ±1°C accuracy keeps every board on profile.
Accurate profiling starts with correct thermocouple placement: attach thermocouples to the hottest and coolest points of the board (typically large BGAs and board edges) using high-temperature solder or Kapton tape. Run a profile with the R10’s WIN10 software, review the curve against your solder paste datasheet, and adjust zone temperatures in small increments (2-5°C). The R10 stores unlimited recipes, so every board type keeps its own verified profile. Re-profile after any significant board design change or oven maintenance.
Nitrogen reflow (factory-installed option) displaces oxygen inside the tunnel to below 1,000 ppm, reducing oxidation during soldering. Benefits include brighter solder joints, better wetting on fine-pitch and OSP-finished boards, fewer voids in BGA and QFN joints, and wider process windows for lead-free alloys. The R10’s nitrogen system includes flow control, distribution manifolds, oxygen monitoring sensors, and sealed tunnel construction to minimize N₂ consumption. Typical N₂ usage ranges from 18-25 m³/h depending on the profile and board load.
Lead-free alloys such as SAC305 (Sn96.5/Ag3.0/Cu0.5) require higher peak temperatures (235-250°C) than traditional SnPb (210-220°C) and tighter process control. The R10 is RoHS-compliant and rated to 300°C, providing headroom above the SAC305 peak for dense boards with heavy thermal mass. The 20-zone architecture delivers the uniform heating lead-free solder demands, while controlled cooling (2-4°C/s) prevents thermal shock and intermetallic brittleness. For OSP-finished boards, nitrogen reflow is recommended to maintain solderability.
Maximize your R10 performance with these manufacturing operation and maintenance guidelines.
1. Verify power supply and check the UPS status indicator. 2. Inspect the mesh belt for tracking and tension. 3. Confirm exhaust and fume extraction are operating. 4. Check nitrogen supply pressure if nitrogen option installed. 5. Load the correct recipe for today’s board type. 6. Run a quick profile check with a test board or profiling system. 7. Monitor zone temperatures during the first 30 minutes of production. 8. Log any temperature deviations in the maintenance record.
Weekly: Clean flux residue from the tunnel entrance and exit, inspect belt tracking, check filters. Monthly: Clean heating elements and temperature sensors, verify SSR operation, lubricate chain. Quarterly: Full calibration of all 20 zones with certified thermocouples, check cooling fans, inspect electrical connections. Annually: Replace flux filters, inspect heating elements for oxidation, complete mechanical inspection of the transport system. The electric top cover reduces maintenance access time from 45 minutes to under 10.
The R10’s electric rail width adjustment (PANASONIC motor) changes PCB width in under 3 minutes with stored presets. For a fast changeover: 1. Record current recipe settings and board dimensions. 2. Select the new product preset — width adjusts automatically. 3. Load the new recipe from the WIN10 recipe library. 4. Confirm profile with a test board. 5. Adjust transport speed for the new board’s thermal mass if needed. Compared to 15-30 minutes of manual adjustment on benchtop ovens, the R10 keeps changeover downtime to a minimum.
The R10 requires a 5-wire 3-phase 380V 50/60Hz supply with 45KW startup capacity (11-13KW normal operation). Ensure adequate exhaust ducting for the built-in fume extraction ports — typical exhaust flow of 8-12 m³/min. Allow 1m clearance around the oven for the electric top cover opening and maintenance access. Operating environment: 5-40°C, 20-90% RH non-condensing. For nitrogen operation, provide a nitrogen supply line with 0.5-0.7 MPa pressure. Floor loading: 2,550 kg net weight, spread across the 6,380mm footprint.
See exactly where the JHIMS R10 fits in your PCB assembly process and how it integrates with upstream and downstream equipment.
The R10 integrates seamlessly with upstream pick-and-place and downstream AOI systems, with Ethernet-enabled data sharing for full line traceability.
| Metric | Manual Printing | JHIMS R10 | Advantage |
|---|---|---|---|
| Temperature Accuracy | ±5-10°C variation | ±1°C across 20 zones | Up to 10× Better |
| Defect Rate | 3,000-8,000 DPMO | <50 DPMO | 99% Fewer Defects |
| Energy Consumption | 18-25 KW continuous | 11-13 KW (30% savings) | 30% Lower Energy |
| Throughput | 10-30 boards/hour | 60-200+ boards/hour | Up to 6× Faster |
| Process Repeatability | Operator-dependent, high variability | Recipe-controlled, 100% repeatable | Consistent Quality |
| Traceability | Manual log or none | Full digital traceability with timestamp | Full Data Logging |
| Changeover Time | 15-30 minutes (manual adjustments) | <3 minutes (electric width adjust) | 10× Faster Changeover |
| Maintenance Downtime | Difficult access, 45-60 min/week | Electric top cover, <10 min/week | 5× Less Downtime |
Based on typical industry benchmarks. Actual results may vary by application and operating conditions.
Enter your current production parameters to calculate how quickly the JHIMS R10 pays for itself.
Every JHIMS machine is assembled, calibrated and burn-in tested in our Shenzhen facility, then carefully packed for international delivery.
Watch the JHIMS R10 performing real-world production tasks. All videos are hosted on YouTube for fast, reliable streaming worldwide.
CUSTOMER SUCCESS STORIES
Real-world results from SMT and PCB manufacturers who work with JHIMS — an ISO 9001 certified reflow oven manufacturer — every case links to a verified JHIMS case study.
LINE AUTOMATIONHow a TCL production line cut changeover time by 85% and lifted throughput by 30% with JHIMS automation.
PCB ASSEMBLYA Vietnamese EMS provider passed a Toyota supplier audit with zero scratch defects after reconfiguring their PCB line.
COST REDUCTIONHow a Mexican PCB assembly operation reduced labor cost by 67% through SMT line automation.
LEARNING CENTER
Practical guides and real case studies about the JHIMS R10 — from daily operation to full line integration, written by JHIMS engineers.
Reference videos: How to Install Reflow Soldering Machine – Step-by-Step Tutorial & Safety Guide | Part 1; Complete Reflow Oven Setup Guide for PCB Assembly | Installation & Training Tutorial | Part 2; Step-by-Step Reflow Soldering Machine Installation | PCB SMT Training Video | Part 3.
| Weight | 2900 kg |
|---|---|
| Dimensions | 6800 × 1650 × 1800 mm |
| Power Supply | 5-wire 3-phase; 380V 50/60Hz |
| Startup Power | 45 KW |
| Normal Operating Power | 11 – 13 KW |
| Temperature Range | Room temp to 300°C |
| Max PCB Width | 460 mm |
| Heating Zones | 10 upper + 10 lower (20 total) |
| Cooling Zones | 3 upper + 3 lower (6 total) |
| Temperature Accuracy | ±1°C |
| Warranty | 1 Year standard (extendable) |