Address
Building A1, Runteng Industrial Park, No. 4 Xishan Road, Longteng Community, Shiyan Subdistrict, Bao'an District, Shenzhen 518000, China
Work Hours
Monday to Saturday: 09:00 – 23:00 (UTC+8)
Sunday: closed
S630 3D SPI Solder Paste Inspection Machine | JHIMS
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S630 — 3D SPI Solder Paste Inspection Machine
PSLM PMP 3D16μm Resolution<5min Programming10YR Optical WarrantyGage R&R <10%
- 🔍 True 3D volumetric measurement — volume, area, height, XY offset & shape
- 🎯 5MP CCD + telecentric lens · 0201 support · D-Lighting & RGB Tune
- 🏭 ISO 9001 · CE compliant · 2,456+ clients in 30+ countries · Global after-sales
3D SOLDER PASTE INSPECTION
JHIMS S630 3D SPI Solder Paste Inspection Machine
Eliminate 70% of SMT defects with true 3D solder paste inspection. The S630 combines industry-leading PSLM PMP projection technology with a 5-megapixel CCD, less than 5-minute Gerber programming, and a 10-year optical warranty — engineered for zero-defect SMT lines in automotive, medical, consumer electronics and LED manufacturing.
ISO 9001 Certified
CE Compliant
Serving 2,456+ Clients in 30+ Countries
36 R&D Engineers
Est. 2012 — 14+ Years of Excellence
Automotive Tier-1 Supplier
Medical Device Manufacturer
Consumer Electronics OEM
Industrial Automation Leader
LED Lighting Manufacturer
Medical Device Manufacturer
Consumer Electronics OEM
Industrial Automation Leader
LED Lighting Manufacturer
Explore JHIMS Solutions: Learn more about SMT assembly equipment and PCBA manufacturing solutions. Complete your quality gate with SPI inspection, AOI systems and X-ray inspection. Build the full line with solder paste printers, pick and place machines and reflow ovens. Support your line with feeders and feeder parts, SMT machine parts and sensors and industrial components. See how JHIMS supports why customers choose JHIMS, review our certificates and warranty policy, or explore buying guides, case studies and FAQ resources.
Pain Points & JHIMS Solutions
Common SMT Inspection Problems
- Traditional 2D SPI misses volume inaccuracies, leading to costly reflow failures
- High false call rate (10-25%) — conventional Moire systems suffer mechanical wear in PZT actuators, degrading accuracy after 2-3 years with $3K-4K replacement costs
- Shadow effect on dark PCBs — black PCBs and ceramic substrates reflect structured light poorly, causing measurement noise and increased false positives
- Slow programming (30+ min) — traditional SPI requires hours for Gerber conversion and third-party software for multi-panel merging
- PCB warpage measurement errors — flexible PCBs warp unpredictably within a single FOV
- Bridging false positives from flux — flux residue and white lines create height signals mimicking short circuits
JHIMS S630 Automation Solutions
- True 3D volumetric measurement with PSLM PMP — volume, area, height, XY offset and shape in one pass
- Zero mechanical wear — software-defined gratings with a 10-year free replacement warranty on the 3D projection head
- D-Lighting dual exposure handles black PCBs and ceramic substrates, cutting false calls below 2% with RGB Tune
- Less than 5-minute Gerber programming with direct dual-file merging — no third-party tools
- Z-axis dynamic compensation with AI-enhanced warp prediction reduces false positives by 25% on flexible circuits
- RGB Tune color filtering ignores flux and silkscreen height signals, eliminating the number-one false bridge source
Product Overview
JHIMS S630 3D SPI Solder Paste Inspection Machine
The JHIMS S630 is a 3D SPI solder paste inspection machine engineered for high-volume SMT lines. As a 3D solder paste inspection system using PSLM PMP projection technology, the S630 delivers true 3D volumetric measurement of every solder paste deposit — volume, area, height, XY offset and shape — with sub-micron repeatability, catching defects before reflow to eliminate 70% of downstream soldering failures. The patented Synchronous Structured Light Technology resolves shadow effect interference, while dual RG (Red-Green) light sources handle high-contrast substrates including black PCBs and ceramic boards. A 5-megapixel industrial CCD camera supports fast, stable inspection down to 0201 components.
Engineered with premium components from Basler/Cognex (Germany/USA), Panasonic/Mitsubishi (Japan), THK/HIWIN (Japan/Taiwan), and Mitsubishi/Siemens (Japan/Germany), the S630 delivers industrial-grade reliability for 24/7 production environments.
Applications: 3D solder paste inspection for automotive electronics, consumer electronics, medical devices, LED manufacturing, new energy, industrial control, telecommunications and home appliance PCB assembly.
Key Features
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PSLM PMP Core Technology
Software-defined grating with programmable phase shifts — zero mechanical wear, zero phase drift, and a 10-year free replacement warranty on the 3D projection head. Adjustable detection height from 550μm to 1200μm without hardware changes.
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5MP High-Resolution Vision
Industrial CCD camera paired with a premium telecentric lens. Supports 0201 component inspection at 13μm, 16μm, or 20μm resolution, with monochrome and color 2D imaging as standard.
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Less Than 5 Min Gerber Programming
100K-pad Gerber files converted in under 10 minutes. Direct dual-file merging without third-party tools, Manual Teach mode for non-Gerber boards, and mixed-side panel support.
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D-Lighting Dual Exposure
Patented 8-frame acquisition (4 high + 4 low exposure) with selectable Black/Normal/Bright PCB modes. Perfectly handles ceramic substrates and dark PCBs that confuse conventional systems.
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RGB Tune Active 2D Lighting
Color-filtered 2D imaging isolates solder paste from flux, white lines and debris, detecting bridges below 30μm that height-only algorithms miss. Color defect images make operator verification easy.
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Multi-Head Technology
Patented 3-color structured light heads at 120-degree intervals capture multiple angles simultaneously, eliminating shadow artifacts on tall components. Configurable as single, dual, or triple head.
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Z-Axis Dynamic Compensation
Real-time PCB warpage tracking with automatic servo feedback and a ±5mm dynamic compensation range. AI-enhanced warp prediction reduces false positives by 25% on flexible circuits.
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Comprehensive SPC Suite
Real-time SPC with X-bar, R-chart, Cp/Cpk analysis, multi-PCB view comparison, custom report formatting, histogram, normal distribution and trend analysis.
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Closed-Loop Printer Control
Auto-triggers stencil cleaning when missing prints are detected and transmits XY offset data to the printer for real-time correction. Proven integration with GKG and Desen printers.
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Badmark Sharing with Placers
Transmits defective board data to pick-and-place machines so they skip bad boards automatically — saving 30% mounting time on multi-panel PCBs. Camera-based barcode scanning included.
Technical Specifications
| Parameter | Specification | Parameter | Specification |
|---|---|---|---|
| Inspection Principle | Sinusoidal white-light projection PMP inspection | Industrial CCD Camera | 5 Megapixel |
| Resolution | 16 μm (13μm / 20μm optional) | 3D Projection Head | Projects periodic fringe patterns; true 3D imaging. 10-year free replacement warranty. |
| Monochrome 2D Image | Standard; facilitates operator defect confirmation | Color 2D Image | Standard; RGB synthesized color 2D images, more intuitive than monochrome |
| Z-Axis Real-Time Lifting | Standard; hardware compensation for board warpage during inspection | FOV Speed | 0.45s per field of view |
| Gage R&R | <10% | Conveyor Mode | Single lane (Dual lane available in D-series) |
| PCB Board Size (L × W) | 50 × 50 ~ 630 × 550 mm | PCB Thickness | 0.4 ~ 7 mm |
| X-Y Mechanism | Inspection head moves in X and Y axes; PCB remains stationary | Fixed Rail Side | Front rail fixed (Rear rail optional) |
| Rail Width Adjustment | Automatic and manual, two modes | PCB Positioning & Clamping | Edge positioning and clamping |
| Conveyor Height | 900 ± 40 mm | PCB Edge Clamping Width | 3 mm |
| Part Height Clearance | Top: 30mm / Bottom: 40mm | Minimum Pad Spacing | 150 μm |
| PCB Conveyance Direction | R→L or L→R; software one-key switching | Operating System | Windows 10 64-bit Enterprise Edition |
| Software Language | Chinese / English | Programming Software | Gerber (RS-274X, RS-274D), CAD |
| Programming Time | < 5 minutes | Program Fine-Tuning Time | < 5 minutes |
| Changeover Time | < 3 minutes | Panelized Program | Convenient panelized program creation (including mixed-side panels) |
| Data Input Types | Stencil file, Gerber (RS-274X, RS-274D); manual window addition supported | SPC Data Acquisition & Analysis | Production Trend, X-bar chart, R chart, Cp, Cpk. Records volume, area, height, offset per solder joint. Defect cause charts, full-board value images, normal distribution, individual component test data curves, real-time defect images. |
| Network Requirements | Supports TCP/IP protocol; real-time image transmission without affecting operation | CPU | Intel i7 |
| Memory | 24 GB (32 GB optional) | Hard Disk | 1 TB HDD / 1 TB SSD optional |
| Operating System | Windows 10 64-bit Enterprise Edition | Monitor | 24″ LCD Monitor |
| Input Devices | Mouse, Keyboard | Dimensions | W1180 × D1330 × H1530 mm |
| Air Supply Requirement | 4 ~ 6 Bar | Weight | 1,160 kg |
| Power Supply | 220 V, 10 A | Power Consumption (Startup / Normal) | Startup: 2.5 kW / Normal operation: 2 kW |
| Operating Air Consumption | 5 L/min | Floor Load Requirement | 450 kg/m² |
| Grounding Requirement | Ground wire required | SMEMA Interface | Equipped; provides good/bad board output signals |
| Safety Protection System | Comprehensive safety indication and interlock system | Barcode Scanning | Camera-based barcode |
| Auto/Manual Inspection | Both modes available | Technical Documentation | Complete technical, operational, and maintenance manuals (including electronic versions) and software installation media |
| Software Upgrade Service | Permanent, free software upgrade service provided | Standard MES System Integration | Standard MES system integration with Webservice API |
Machine Configuration — Premium Global Components
Every JHIMS S630 is built with world-class components. We source only from industry-leading brands to ensure long-term reliability and precision.
Panasonic / Mitsubishi
🇯🇵 Japan
Servo Motors
THK / HIWIN
🇯🇵/🇹🇼 Japan / Taiwan
Linear Guide Rails
Basler / Cognex
🇩🇪/🇺🇸 Germany / USA
Vision Camera (5MP)
Mitsubishi / Siemens
🇯🇵/🇩🇪 Japan / Germany
PLC Controller
SMC / Festo
🇯🇵/🇩🇪 Japan / Germany
Pneumatic Components
Keyence / Omron
🇯🇵 Japan
Sensors & Fiber Optics
JHIMS PSLM
🇨🇳 China
3D Projection Head (10YR Warranty)
German-Engineered
🇩🇪 Germany
Telecentric Lens
THK / TBI Motion
🇯🇵/🇹🇼 Japan / Taiwan
Ball Screws
Intel i7 / 24GB
🇺🇸 USA
Industrial PC
Applications & Industries
The JHIMS S630 3D SPI Solder Paste Inspection Machine is a versatile workhorse deployed across mission-critical electronics manufacturing sectors worldwide.
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Automotive Electronics
📱
Consumer Electronics
🏥
Medical Devices
💡
LED Manufacturing
⚡
New Energy
🏭
Industrial Control
📡
Telecommunications
🏠
Home Appliances
In-Depth Knowledge Hub
Industry-Specific SPI Solutions
Automotive ECU Production Line
Full SPI-AOI closed-loop integration for engine control unit PCB assembly, with real-time SPC monitoring achieving CPK above 1.67 across 24/7 operation. IATF 16949-compliant traceability from solder paste print to final inspection keeps tier-1 automotive suppliers audit-ready.
5G Base Station PCB Assembly
High-precision 3D inspection for RF-sensitive boards with impedance-critical traces. PSLM technology handles large-format PCBs up to 630×550mm with consistent sub-micron repeatability across the entire board surface.
Smartphone Mainboard High-Mix Line
Under 3-minute changeover between product variants with PLC preset storage for up to 50 board types. Dynamic Mark Point recognition eliminates per-panel fiducial reading, saving 40% inspection cycle time on multi-panel arrays.
Medical Implant PCB Assembly
Cleanroom-compatible configuration with HEPA-filtered enclosure options, 100% traceability with barcode-to-SPC data linking, and validated inspection processes meeting FDA 21 CFR Part 11 electronic record requirements.
LED TV Backlight Strip Production
Dedicated L-series SPI for ultra-long LED strips up to 1.2 meters. D-Lighting technology handles reflective aluminum substrates, while RGB Tune filtering eliminates false bridges from conformal coating reflections.
FPC Flex Circuit Assembly
Telecentric lens static compensation solves within-FOV warp variation, with dedicated FPC fixtures and vacuum clamping options. AI warp prediction reduces false positives by 25% versus standard Z-axis compensation alone.
SPI Technology Guide
Understanding 3D solder paste inspection technology is essential for optimizing your SMT assembly process. Below is a comprehensive technical reference for engineers and process managers.
PSLM PMP: How Software-Defined Gratings Work
Unlike traditional Moire systems that use physical glass gratings driven by piezoelectric actuators, JHIMS PSLM generates sinusoidal fringe patterns entirely through software. This eliminates 231 million mechanical drive cycles per year (calculated for 5K boards/day, 30 FOVs/board) — resulting in zero mechanical wear, zero phase drift, and a 10-year optical warranty.
D-Lighting: Dual Exposure for Challenging Substrates
The S630 captures 8 images per FOV — 4 with high exposure and 4 with low exposure. For black PCBs that absorb most projected light, the high-exposure group ensures sufficient signal; for reflective ceramic substrates, the low-exposure group prevents saturation. The algorithm intelligently fuses both groups into a single noise-free 3D reconstruction.
RGB Tune: Color-Based Bridge Detection
Conventional SPI systems detect bridging purely by height continuity between adjacent pads, which fails when flux residue or white silkscreen lines create height signals. JHIMS RGB Tune captures a color 2D image and filters by solder paste color (typically grey-metallic), ignoring non-solder height features — eliminating the number-one source of false bridge calls in production.
Multi-Head: 120-Degree Triangulation
Three independently colored structured light projectors at 120-degree intervals illuminate the solder paste from different azimuth angles, creating three separate 3D reconstructions that are merged to eliminate shadow artifacts — particularly critical for tall components (up to 30mm top clearance) that cast shadows in single-projector systems.
Manufacturing Best Practices Guide
Maximize your S630 performance with these manufacturing operation and maintenance guidelines.
7-Stage Quality Control Process
Every S630 undergoes incoming QC (IQC), 5-axis CNC precision machining (±0.02mm), sub-assembly, final assembly with digital torque verification, 48-hour burn-in testing with 500-800 customer sample boards, 120-point final QC inspection, and vacuum-sealed export packaging with shock indicators.
48-Hour Burn-In Test Protocol
Each machine runs continuously for 48 hours using customer-provided PCB samples (500-800 boards). Vibration stability, speed consistency, and false call rate are logged every 30 minutes. Only machines passing all 48 checkpoints receive a “Birth Certificate” shipped with the unit.
Preventive Maintenance Schedule
Daily: clean conveyor rails and verify SMEMA signals. Weekly: inspect and clean the 3D projection head lens with approved optical wipes. Monthly: verify calibration with a NIST-traceable standard board and run full Gage R&R. Quarterly: check pneumatic fittings, replace air filters, and verify grounding resistance.
Calibration & Accuracy Verification
JHIMS provides NIST-traceable calibration standards. The S630 achieves Gage R&R below 10%, height repeatability under 1μm (3σ), and volume/area repeatability under 1% (3σ). Annual recalibration service is available through our global service network or remote diagnostic tools.
Production Workflow — S630 in Your SMT Line
The S630 sits at the most critical quality gate in SMT assembly — immediately after solder paste printing. Catching defects here prevents 70% of downstream reflow failures.
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PCB Loader
PCB Loader
→
🖨️
Solder Paste Printer
Solder Paste Printer
→
🔍
S630 3D SPI
⭐ This Product
S630 3D SPI
⭐ This Product
→
🤖
Pick & Place
Pick & Place
→
🔥
Reflow Oven
Reflow Oven
→
🔎
AOI Inspection
AOI Inspection
→
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PCB Unloader
PCB Unloader
The S630 closes the loop: it feeds XY offset data back to the printer for real-time correction and transmits Badmark information forward to the pick-and-place machine to skip defective boards — saving 30% mounting time on multi-panel runs.
Manual vs Automatic Inspection — The ROI of Automation
| Metric | Manual Printing | JHIMS S630 | Advantage |
|---|---|---|---|
| Measurement Type | Subjective visual check / 2D area only | True 3D: Volume + Area + Height + XY Offset + Shape | S630 |
| Height Accuracy | Not measurable / Estimated from grayscale | <1μm repeatability (3σ) | True 3D |
| Volume Measurement | Impossible / Estimated (not true volume) | True volumetric measurement <1% repeatability | True 3D |
| Defect Detection Rate | 60-70% / 75-85% | >99% | True 3D |
| False Call Rate | N/A / 10-25% | <2% (with RGB Tune) | 5× Fewer Calls |
| Inspection Speed | ~2 min/board / ~30 sec/board | ~15 sec/board (630×550mm) | 5× Faster |
| Programming Time | N/A / 30-60 min | <5 min (Gerber import) | 5× Faster |
| Operators Required | 2-3 per line / 1 per 2 lines | 1 per 4+ lines | 4× Less Labor |
| SPC Data | None / Basic pass/fail | Full SPC: Cp/Cpk, X-bar, R, trend, histogram, defect pareto | S630 |
| Annual Mechanical Wear | N/A / Moderate | Zero (PSLM software-defined gratings) | S630 |
| Warranty | N/A / 12 months | 10-year optical + permanent free software upgrades | S630 |
Based on typical industry benchmarks. Actual results may vary by application and operating conditions.
ROI Calculator — See Your Payback Period
Enter your current production parameters to calculate how quickly the JHIMS S630 pays for itself.
Factory Tour — See JHIMS Manufacturing Excellence
Every JHIMS machine is assembled, calibrated and burn-in tested in our Shenzhen facility, then carefully packed for international delivery.
JHIMS S630 3D SPI System
JHIMS Assembly Workshop
JHIMS Aging Test Workshop
JHIMS Demonstration Workshop
Product Videos — See the S630 in Action
Watch the JHIMS S630 performing real-world production tasks. All videos are hosted on YouTube for fast, reliable streaming worldwide.
3D Solder Paste Inspection (SPI): Ultimate Guide
AOI Inspection for PCB: A Complete Guide
AOI PCB Inspection Machine Programming
How SMT Vision Printers Inspect Solder Paste with 2D Inspection
CUSTOMER SUCCESS STORIES
Trusted by SMT Factories Worldwide
Real-world results from SMT and PCB manufacturers who work with JHIMS — an ISO 9001 certified SMT equipment manufacturer — every case links to a verified JHIMS case study.
LINE AUTOMATIONTCL + JHIMS: 85% Faster Changeover, 30% More Throughput
How a TCL production line cut changeover time by 85% and lifted throughput by 30% with JHIMS automation.
85%Faster Changeover
+30%More Throughput
PCB ASSEMBLYMason Electronics Vietnam: Zero Scratch Defects in Toyota Supplier Audit
A Vietnamese EMS provider passed a Toyota supplier audit with zero scratch defects after reconfiguring their PCB line.
ZeroScratch Defects
PassToyota Audit
COST REDUCTIONMexico PCB Assembly — 67% Labor Reduction
How a Mexican PCB assembly operation reduced labor cost by 67% through SMT line automation.
-67%Labor Cost
AutomatedSMT Line
Frequently Asked Questions
🔧 Technical Questions
The S630 supports inspection down to British 0201 (metric 0603) components at 16μm resolution. With the optional 13μm resolution upgrade, it can reliably inspect 01005 (metric 0402) components. Minimum pad spacing is 150μm.
PSLM (Programmable Structured Light Modulation) with PMP (Phase Modulation Profilometry) uses software-defined sinusoidal grating patterns instead of physical glass gratings. Unlike traditional Moire systems that use piezoelectric actuators (PZT) for mechanical phase shifting, PSLM eliminates all mechanical drive components — resulting in zero wear, zero phase drift, and a 10-year free replacement warranty on the optical head. Traditional Moire systems accumulate 231 million mechanical cycles per year (at 5K boards/day), leading to accuracy degradation after 2-3 years.
The S630 supports PCB sizes from 50 × 50 mm to 630 × 550 mm (L × W), with thickness ranging from 0.4 mm to 7 mm. For larger boards, JHIMS offers the 1.2-meter L-series dedicated SPI model.
The S630 achieves the industry’s fastest Gerber programming time — under 5 minutes for a typical board. A 100,000 solder pad Gerber file can be converted in under 10 minutes. Direct merging of two Gerber files into one test program is supported without third-party tools. When Gerber data is unavailable, the manual Teach function enables programming and inspection.
Yes. The S630 is equipped with real-time Z-axis dynamic profiling and, for dedicated FPC applications, JHIMS offers a version with a telecentric lens for static warp compensation. This combination handles within-FOV warp variation that simple Z-axis compensation cannot resolve. AI-enhanced warp prediction further reduces false positives by 25%.
Conventional SPI detects bridging purely by height continuity between adjacent pads. This fails when flux residue, white silkscreen lines, or debris create height signals. JHIMS RGB Tune captures a color 2D image using tri-color (Red, Green, Blue) active lighting and filters by solder paste color (typically grey-metallic), ignoring non-solder height features. It can detect ultra-thin bridges below 30μm that height-only systems miss, and displays color defect images for easy operator verification.
D-Lighting is a patented dual-exposure technology that captures 8 images per FOV — 4 with high exposure and 4 with low exposure. For black PCBs that absorb projected light, the high-exposure group ensures sufficient signal. For highly reflective ceramic substrates, the low-exposure group prevents saturation. The algorithm intelligently fuses both groups. Users can select Black, Normal, or High-Brightness PCB modes in the software.
The standard S630 configuration includes a single inspection head. JHIMS offers optional Multi-Head configurations (dual or triple head) using the patented 120-degree triangulation technology, where three differently colored structured light projectors illuminate solder paste from different azimuth angles for shadow-free 3D reconstruction.
The S630 achieves Gage R&R (Repeatability and Reproducibility) of less than 10%, with height repeatability under 1μm (3σ) and volume/area repeatability under 1% (3σ). This exceeds the industry standard requirement of GR&R < 30% for measurement systems used in production quality control.
The S630 offers three resolution options: 13μm, 16μm (standard), and 20μm. Higher resolution (13μm) is recommended for inspecting ultra-fine-pitch components and 01005 packages. The 16μm option provides a balance of speed and accuracy for most applications. The 20μm option maximizes throughput for larger components.
Yes. The S630 supports full closed-loop communication with solder paste printers. When the SPI detects missing prints, it automatically triggers a stencil cleaning command to the printer. It also transmits measured XY offset data so the printer can make real-time corrections. This has been proven to work with GKG and Desen printers, and can be integrated with other printer brands that provide open communication protocols.
The S630 includes comprehensive SPC tools: Production Trend charts, X-bar and R charts, Cp and Cpk calculations, defect cause Pareto charts, full-board value images, normal distribution charts, individual component test data curves, real-time defect image output, and abnormal data/image storage. The unique Multi PCB View feature can simultaneously compare two different datasets in one tool.
Yes. With the optional barcode scanning module, the S630 can transmit defective board (Badmark) information to compatible pick-and-place machines. The placer then skips bad boards automatically, saving up to 30% mounting time on multi-panel PCBs. This requires the placer to support Badmark communication and open its protocol to SPI integration.
The S630 achieves 0.45 seconds per field of view (FOV). The total inspection time per board depends on board size, resolution setting, and component density. A typical 200×300mm board at 16μm resolution completes in approximately 12-18 seconds.
The standard measurement range is ±550μm. With the optional PSLM height extension, this can be increased to ±1200μm — useful for red glue dispensing inspection, epoxy applications, and boards with tall solder preforms.
The S630 base model is a single-lane configuration. For dual-lane requirements, JHIMS offers the S630 D-series with independent dual-lane operation supporting AA and AB program modes (same or different PCB types in each lane). Lane 1 is fixed; lanes 2, 3, and 4 are movable with maximum spacing of 686mm between lanes 1 and 4.
The S630 runs on Windows 10 64-bit Enterprise Edition, installed on an industrial-grade PC with Intel i7 processor, 24GB RAM (32GB optional), and 1TB storage (HDD standard, SSD optional). The software supports both Chinese and English interfaces.
The S630 supports Gerber RS-274X and RS-274D formats, CAD data import, stencil file import, and manual window addition. Panelized programs (including mixed-side panels) can be created conveniently within the software.
🛡️ Warranty & After-Sales
The S630 comes with a full 1-year comprehensive warranty covering all hardware and software. The 3D projection head (PSLM optical module) carries an industry-leading 10-year free replacement warranty. Software upgrades are provided permanently and free of charge for the lifetime of the machine.
JHIMS provides comprehensive global after-sales support including: professional technical support via phone/email/WhatsApp, remote video diagnostics for quick troubleshooting, on-site service by trained engineers in major markets, operator and engineer training programs, complete technical/operational/maintenance documentation (electronic and printed), and permanent free software updates.
JHIMS recommends monthly calibration verification using a NIST-traceable standard board and full Gage R&R analysis. Unlike Moire-based systems that require quarterly recalibration due to PZT drift, the S630’s PSLM technology maintains calibration stability for extended periods. Annual professional recalibration service is available through our global service network or via remote diagnostic tools.
JHIMS provides comprehensive training including: 3-5 days of on-site operator training at customer facility, programming and Gerber import training, SPC analysis and interpretation training, maintenance and troubleshooting training, and train-the-trainer programs for customer training teams. Remote training sessions are also available.
Yes. JHIMS maintains a comprehensive spare parts inventory at our Shenzhen headquarters and at regional service centers. Common consumables and wear parts are stocked for immediate shipment. Critical components (cameras, projection heads, motion controllers) are available with 24-48 hour express shipping to most global destinations.
Each S630 ships with: printed and electronic operation manual, printed and electronic maintenance manual, software installation media with license, electrical and pneumatic schematics, parts list with ordering codes, calibration certificates (NIST-traceable), and machine “Birth Certificate” documenting the 120-point QC inspection results.
Absolutely. JHIMS offers customization services including: conveyor direction modification, custom rail configurations, specialized lighting for unique substrates, custom SPC report formats, MES integration protocol development, barcode reader integration, and custom fixture design for non-standard PCB shapes.
With proper preventive maintenance, the S630 has a design service life of 8-10 years. The PSLM optical module carries a 10-year warranty. Many JHIMS SPI machines installed in 2015 are still operating at full specification today. The use of premium international-brand components (THK guides, Panasonic/Mitsubishi servos, SMC pneumatics) ensures long-term reliability.
Yes. JHIMS provides remote diagnostic support via TeamViewer or similar secure remote access software. Our engineers can remotely connect to the S630 (with customer permission), diagnose issues, adjust parameters, and guide on-site operators through troubleshooting procedures. This significantly reduces downtime — most issues are resolved within hours rather than days waiting for on-site service.
Daily: clean conveyor rails and verify SMEMA interface signals. Weekly: inspect and clean the 3D projection head lens with approved optical wipes; check pneumatic fittings for leaks. Monthly: run full calibration verification with NIST-traceable standard board; perform Gage R&R analysis. Quarterly: replace air filters, check all electrical connections, verify grounding resistance (<1Ω), and lubricate guide rails with approved grease. Full details are provided in the maintenance manual.
Yes. The S630’s networked architecture supports one operator managing up to 4 machines from a single repair workstation. Network SPC enables one server to monitor all SPI machines across an entire workshop. The optional dashboard management system consolidates data from up to 8 production lines onto a single display. Fingerprint recognition modules are available for tiered operator/engineer access control.
Yes. JHIMS has developed multiple data format ports for MES integration. The S630 supports Webservice API calls including CheckUserDo for operator authentication and WeldInputTest for test data upload. Both forced-login (must authenticate to operate) and non-forced modes are supported. Custom API development for specific MES platforms is available as an engineering service.
Beyond the 10-year free replacement period, JHIMS continues to support PSLM modules with paid replacement and repair services. Given that the PSLM module has no mechanical wear components, failures beyond year 10 are extremely rare. Our oldest field units (2015 installation) continue to operate with original PSLM modules at full specification. JHIMS is committed to supporting machines throughout their operational life.
🚚 Shipping & Payment
The S630 machine dimensions are W1180 × D1330 × H1530 mm, with a net weight of 1,160 kg. Shipping dimensions and weight (with export packaging) are approximately W1400 × D1550 × H1750 mm and 1,350 kg. A floor load capacity of at least 450 kg/m² is required at the installation site.
Standard lead time is 4-6 weeks from order confirmation to ex-works shipment. Custom configurations may require additional 1-2 weeks. Air freight shipping to most global destinations takes 5-10 days. Sea freight takes 20-40 days depending on destination. JHIMS maintains buffer stock of standard configurations for urgent orders.
Every S630 is shipped in a reinforced plywood export crate with vacuum-sealed moisture barrier, shock indicators (to verify no impact during transit exceeded safe limits), desiccant packets for humidity control, and complete export documentation including commercial invoice, packing list, certificate of origin, and Form E/F for tariff preferences where applicable.
Power: 220V AC, 10A, single-phase (50-60Hz). Power consumption: 2.5 kW at startup, 2 kW during normal operation. Compressed air: 4-6 Bar, consumption 5 L/min (oil-free, filtered, dried). A dedicated ground wire is required. The conveyor height is 900 ± 40 mm.
Standard payment terms: 70% T/T deposit with the order, 30% T/T before shipment. Existing customers may use L/C at sight.
JHIMS has exported to 30+ countries including USA, Germany, UK, Italy, South Africa, Malaysia, Singapore, Vietnam, India, Mexico, and many others. We handle all export documentation including CE certification, certificate of origin, and customs clearance support. For countries not yet on our export list, our logistics team can arrange first-time shipment.
Standard pricing includes remote installation guidance via video call. On-site installation, commissioning, and training by a JHIMS engineer is available as an optional service — quoted separately based on destination and duration (typically 5-7 days). Many customers find remote guidance sufficient; we recommend on-site support for the first machine in a new facility.
JHIMS typically ships under FOB Shenzhen or CIF destination port terms. EXW (Ex-Works) is also available for buyers with their own freight forwarders. DAP (Delivered at Place) can be arranged for turnkey delivery. Contact our sales team to discuss the best Incoterm for your location and logistics preferences.
Yes, the S630 is CE compliant and meets EU safety, EMC and machinery directive requirements. CE documentation is provided with every machine. The machine meets all requirements for import and operation in the European Union, UK, and other CE-recognizing markets.
Absolutely. JHIMS welcomes customer factory visits at our Shenzhen headquarters. You can see the S630 being built, observe the 7-stage QC process, witness the 48-hour burn-in test, and meet our engineering team. Video factory tours are also available for buyers who cannot travel. Contact us to schedule a visit.
International warranty terms are identical to domestic: 1-year comprehensive warranty with remote support included. For on-site warranty service, JHIMS coordinates with local service partners where available. Critical spare parts are shipped via express courier (DHL/FedEx/UPS) to minimize downtime. Extended warranty packages (2-3 years) are available.
JHIMS offers competitive trade-in programs when upgrading from older JHIMS SPI models or from other brands. Trade-in value is assessed based on machine age, condition, and service history. Contact our sales team with your current machine details for a trade-in evaluation.
LEARNING CENTER
Knowledge Center — Expert Resources
Practical guides and real case studies about 3D SPI inspection and SMT quality control, written by JHIMS engineers — from procurement to line integration.
Reference videos: 3D Solder Paste Inspection (SPI): Ultimate Guide to High-Precision PCB Manufacturing; watch the process on YouTube; watch the process on YouTube.
| Weight | 1160 kg |
|---|---|
| Dimensions | 1180 × 1330 × 1530 mm |
| PCB Board Size (L × W) | 50 × 50 ~ 630 × 550 mm |
| PCB Thickness | 0.4 ~ 7 mm |
| Part Height Clearance | Top: 30mm / Bottom: 40mm |
| PCB Conveyance Direction | R→L or L→R; software one-key switching |
| Programming Time | < 5 minutes |
| Power Supply | 220 V, 10 A |
| Power Consumption (Startup / Normal) | Startup: 2.5 kW / Normal operation: 2 kW |